Semiconductor Device Including a Trench at Least Partially Filled with a Conductive Material in a Semiconductor Substrate and Method of Manufacturing a Semiconductor Device

ABSTRACT

A semiconductor device includes a semiconductor substrate and a first trench extending into or through the semiconductor substrate from a first side. The first trench is at least partially filled with a conductive material and electrically connected to the semiconductor substrate via a doped semiconductor layer at a sidewall of the first trench. A semiconductor layer adjoins the semiconductor substrate at the first side, and caps the first trench at the first side. A contact is disposed at a second side of the semiconductor substrate opposite to the first side. A method of manufacturing the semiconductor device is also provided.

BACKGROUND

In vertical semiconductor devices, current flows between a first side ofa semiconductor die to a second side of the semiconductor die, oppositethe first side. As an example, current flows from a source of a fieldeffect transistor (FET) at the first side to a drain at the second side.The semiconductor die may be mounted to a carrier, e.g., a lead frame ora direct copper bonded (DCB) substrate, via the second side. In verticalsemiconductor devices, a low ohmic contact between a bottom side of thesemiconductor device and the carrier as well as a low ohmic current paththrough the semiconductor device from the first side to the second sideare desirable. In semiconductor devices including high current densitiesduring operation, e.g., in low voltage FETs including voltage blockingcapabilities below 100 V, any parasitic resistance between the firstside and the second side of the device is detrimental. Since a driftzone of low-voltage semiconductor devices is thin, compared to devicesincluding higher voltage blocking capabilities, thin wafer techniquesare one way of realizing the devices.

It is desirable to reduce an on-state resistance in a verticalsemiconductor device.

SUMMARY

According to an embodiment, a semiconductor device includes asemiconductor substrate. The semiconductor device further includes afirst trench extending into or through the semiconductor substrate froma first side. The semiconductor device further includes a semiconductorlayer adjoining the semiconductor substrate at the first side. Thesemiconductor layer caps the first trench at the first side. Thesemiconductor device further includes a contact at a second side of thesemiconductor substrate opposite to the first side.

According to another embodiment, a semiconductor wafer includes asilicon substrate. The semiconductor wafer further includes a trenchextending into the silicon substrate from a first side. Thesemiconductor wafer further includes a semiconductor layer adjoining thesilicon substrate, wherein the semiconductor layer caps the first trenchat the first side.

According to another embodiment, a method of manufacturing asemiconductor device includes forming a first trench into asemiconductor substrate from a first side. The method further includesforming a semiconductor layer adjoining the semiconductor substrate atthe first side, wherein the semiconductor layer caps the first trench atthe first side. The method further includes forming a contact at asecond side of the semiconductor substrate opposite to the first side.

Those skilled in the art will recognize additional features andadvantages upon reading the following details of the description andupon viewing the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a furtherunderstanding of the invention and are incorporated in and constitute apart of this specification. The drawings illustrate embodiments of thepresent invention and together with the description serve to explainprinciples of the invention. Other embodiments of the invention andintended advantages will be readily appreciated as they become betterunderstood by reference to the following detailed description.

FIG. 1 is a schematic cross-sectional view of a portion of asemiconductor device including a trench in a semiconductor substratecapped by a semiconductor layer.

FIG. 2A is a schematic cross-sectional view of a portion of a planargate transistor cell formed in the semiconductor layer illustrated inFIG. 1.

FIG. 2B is a schematic cross-sectional view of a portion of a trenchgate transistor cell formed in the semiconductor layer illustrated inFIG. 1.

FIG. 3A is a schematic cross-sectional view of the trench illustrated inFIG. 1 partly filled with a conductive material.

FIG. 3B is a schematic cross-sectional view of the trench illustrated inFIG. 1 partly filled with a conductive material and a diffusion barrieron top of the conductive material.

FIG. 3C is a schematic cross-sectional view of the trench illustrated inFIG. 1 partly filled with a conductive material and a diffusion barrieron top and at a side of the conductive material.

FIG. 3D is a schematic cross-sectional view of the trench illustrated inFIG. 1 partly filled with a conductive material and a dielectric at abottom of the trench.

FIG. 4 illustrates is a schematic illustration of one embodiment of aprofile of n-doping and p-doping along line A-A′ of FIG. 1.

FIG. 5 is a schematic plan view illustrating several trench geometriesthat may be used individually or in any combination with regard to thefirst trench illustrated in FIG. 1.

FIGS. 6A and 6B illustrate a schematic cross-sectional view and aschematic plan view of a semiconductor wafer according to an embodiment.

FIG. 6C illustrates a scanning electron micrograph of a part of asemiconductor substrate as illustrated in FIGS. 6A and 6B.

FIG. 7 is a simplified flow chart of a method of manufacturing asemiconductor device according to an embodiment.

FIG. 8A is a schematic cross-sectional view of a semiconductor substrateafter forming trenches at a first side in accordance with an embodiment.

FIG. 8B is a schematic cross-sectional view of the semiconductorsubstrate of FIG. 8A after filling the trench at least partly with aconductive material.

FIG. 8C is a schematic cross-sectional view of the semiconductorsubstrate of FIG. 8B after forming a semiconductor layer adjoining thesemiconductor substrate at the first side.

FIG. 8D is a schematic cross-sectional view of the semiconductorsubstrate of FIG. 8C after removing a part of the semiconductorsubstrate from a second side opposite to the first side.

FIG. 8E is a schematic cross-sectional view of the semiconductorsubstrate of FIG. 8D after forming a contact at the second side.

DETAILED DESCRIPTION

In the following detailed description, reference is made to theaccompanying drawings, which form a part hereof, and in which are shownby way of illustration specific embodiments in which the invention maybe practiced. It is to be understood that other embodiments may beutilized and various structural or logical changes may be made withoutdeparting from the scope of the present invention. For example, featuresillustrated or described for one embodiment can be used on or inconjunction with other embodiments to yield yet a further embodiment. Itis intended that the present invention includes such modifications andvariations. The examples are described using specific language whichshould not be construed as limiting the scope of the appending claims.

The drawings are not scaled and are for illustrative purposes only. Forclarity, corresponding elements have been designated by the samereferences in the different drawings if not stated otherwise.

Terms such as “first”, “second”, and the like, are used to describevarious elements, regions, sections, etc. and are also not intended tobe limiting. Like terms refer to like elements throughout thedescription.

The terms “having”, “containing”, “including”, “comprising” and the likeare open and the terms indicate the presence of stated structures,elements or features but do not preclude additional elements orfeatures.

The articles “a”, “an” and “the” are intended to include the plural aswell as the singular, unless the context clearly indicates otherwise.

The Figures illustrate relative doping concentrations by indicating “⁻”or “⁺” next to the doping type “n” or “p”. For example, “n⁻” means adoping concentration which is lower than the doping concentration of an“n”-doping region while an “n⁺”-doping region has a higher dopingconcentration than an “n”-doping region. Doping regions of the samerelative doping concentration do not necessarily have the same absolutedoping concentration. For example, two different “n”-doping regions mayhave the same or different absolute doping concentrations.

The term “electrically connected” describes a permanent low-ohmicconnection between electrically connected elements, such as a directcontact between the concerned elements or a low-ohmic connection via ametal and/or highly doped semiconductor. The term “electrically coupled”encompasses “electrically connected” but further includes that one ormore intervening element(s) adapted for signal transmission may beprovided between the electrically coupled elements, such as elementsthat are controllable to temporarily provide a low-ohmic connection in afirst state and a high-ohmic electric decoupling in a second state.

FIG. 1 illustrates a part of a semiconductor device 100 according to anembodiment.

The semiconductor device 100 includes a semiconductor substrate 110.According to an embodiment, the semiconductor substrate 110 is amonocrystalline silicon substrate. According to other embodiments, thesemiconductor substrate 110 includes other semiconductor materials, e.g.SiC or GaN.

A first trench 115 extends through the semiconductor substrate 110 froma first side 120. A semiconductor layer 125 adjoins the semiconductorsubstrate 110 at the first side 120. The semiconductor layer 125 capsthe first trench 115 at the first side 120. In other words, thesemiconductor layer 125 closes the first trench 115 at the first side120 and thus acts at a sealing layer sealing the first trench 115 at thefirst side 120. The first trench 115 is buried in the semiconductorsubstrate 110 below the semiconductor layer 125.

At a second side 130 of the semiconductor substrate 110, a contact 135adjoins a bottom side of the first trench 115. The contact 135 includesone or a plurality of conductive materials. As an example, the contactmay include a layer or a layer stack of any one or any combination of ahighly doped semiconductor, a semiconductor-metal-compound, carbon, ametal and a metal alloy.

In the embodiment illustrated in FIG. 1, the first trench extendsthrough the semiconductor substrate 110 to the contact 135. In otherwords, the contact 135 closes a bottom side of the first trench 115 andthus act as a sealing layer sealing the first trench 115. According toanother embodiment, the first trench 115 may end in the semiconductorsubstrate 110, and a part of the semiconductor substrate 110 remainsbetween a bottom side of the first trench 115 and the contact 135 at thesecond side 130.

In the semiconductor layer 125, doped regions constituting functionalelements of the semiconductor device 100 are formed. According to anembodiment, the semiconductor device 100 is a discrete semiconductorincluding a plurality of transistor cells arranged in one or more cellarrays. Examples for the semiconductor device 100 include an FET, e.g.an insulated gate field effect transistor (IGFET), for example a metaloxide semiconductor field effect transistor (MOSFET) including FETs withmetal and with non-metal gate electrodes and an insulated bipolartransistor (IGBT). According to another embodiment, the semiconductordevice 100 is an integrated circuit including a plurality of circuitelements, e.g., resistors, for example diffusion resistors, transistors,diodes, capacitors.

One example of a planar gate transistor formed in the semiconductorlayer 125 is described further below with reference to FIG. 2A. Anotherexample of a trench gate transistor formed in the semiconductor layer125 is described further below with reference to FIG. 2B. Embodiments offillings of the first trench 115 are described further below withreference to FIGS. 3A to 3D.

According to an embodiment, a depth d of the first trench 115 along avertical direction y perpendicular to the first side 120 ranges between20 μm and 200 μm.

According to an embodiment, a maximum width w of the first trench 115ranges between 0.2 μm to 10 μm. If the first trench 115 includes ataper, the maximum width refers to that part of the first trench 115which includes a maximum distance of opposite sidewalls along a lateraldirection x.

According to an embodiment, an aspect ratio of the first trench 115ranges between 10 and 50. The aspect ratio is defined as the depth of atrench divided by its width.

FIG. 2A illustrates a schematic cross-sectional view of a portion of aplanar gate transistor cell formed in a part 126 of the semiconductorlayer 125 illustrated in FIG. 1. At a surface 140 of the semiconductorlayer 125, a p-doped body region 145 and an n⁺-doped source region 150are formed. The p-doped body region 145 and the n⁺-doped source region150 are electrically coupled to a source contact 155 at the surface 140.An electrical contact between the source contact 155 and the p-dopedbody region 145 may be improved by arrangement of a p⁺-doped bodycontact zone. The source contact 155 is illustrated in a simplifiedmanner in FIG. 2A and may include a conductive material arranged in anopening of a dielectric layer formed on the surface 140. As an example,the contact may be a contact plug or a contact line including highlydoped polycrystalline semiconductor material, metal silicide, e.g., anyof or any combination of TiSi₂, MoSi₂, WSi₂, PtSi₂ and/or metal, e.g.,any of or any combination of W, Al, Cu, Pd, Ti, Ta, TiN, TaN, or acombination thereof.

A planar gate structure 160 including a gate dielectric 161 and a gateelectrode 162 adjoins the surface 140. A current of the planar gatetransistor cell illustrated in FIG. 2A flows between the source contact155 at the surface 140 along the vertical direction y to the contact 135at the second side 130 (see also FIG. 1). In the example illustrated inFIGS. 1 and 2A, the contact 135 at the second side is a drain contact.

FIG. 2B illustrates a schematic cross-sectional view of a portion of atrench gate transistor cell formed in the part 126 of the semiconductorlayer 125 illustrated in FIG. 1. A gate trench 171 extends into thesemiconductor layer 125 from a surface 140. In the embodimentsillustrated in FIG. 2B, a bottom side of the gate trench 171 ends abovea top side of the first trench 115. In other words, the gate trench 171ends in the semiconductor layer 125 and does not extend through thesemiconductor layer 125 into the semiconductor substrate 110. Accordingto other embodiments, the gate trench 171 extends through thesemiconductor layer 125 into the semiconductor substrate 110. The gatetrench 171 includes a gate electrode 173 surrounded by a dielectric 172.A part of the dielectric 172 between the gate electrode 173 and ap-doped body region 175 constitutes a gate dielectric. As an example,the gate dielectric may be a thermal oxide. The dielectric 172 mayinclude further dielectric materials and/or layers, e.g., depositedoxides, such oxides deposited by chemical vapor deposition (CVD) andnitrides such as Si₃N4.

At a surface 140 of the semiconductor layer 125, the p-doped body region175 and an n⁺-doped source region 180 are formed. The p-doped bodyregion 175 and the n⁺-doped source region 180 are electrically coupledto a source contact 185 at the surface 140. An electrical contactbetween the source contact 185 and the p-doped body region 175 may beimproved by arrangement of a p⁺-doped body contact zone. The sourcecontact 185 is illustrated in a simplified manner in FIG. 2B and mayinclude a conductive material arranged in an opening of a dielectriclayer formed on the surface 140. As an example, the contact may be acontact plug or a contact line including highly doped polycrystallinesemiconductor material, metal silicide, e.g., any of or any combinationof TiSi₂, MoSi₂, WSi₂, PtSi₂ and/or metal, e.g., any of or anycombination of W, Al, Cu, Pd, Ti, Ta, TiN, TaN, or a combinationthereof.

A current of the trench gate transistor cell illustrated in FIG. 2Bflows between the source contact 185 at the surface 140 along thevertical direction y to the contact 135 at the second side 130 (see alsoFIG. 1). In the example illustrated in FIGS. 1 and 2B, the contact atthe second side is a drain contact. A conductivity in a channel region187 adjoining the gate dielectric can be controlled via a gate voltageapplied to the gate electrode 173.

The dielectric 173 surrounding the gate electrode 173 may have differentthickness, e.g., may be thicker below the gate electrode 173.Additionally, below the gate electrode 173 one or more additionalelectrodes may be formed in the gate trench 171 and may bedielectrically insulated from the semiconductor layer 125. This one ormore additional electrode(s) may be electrically floating or may beconnected to a voltage, e.g., one or more of the additional electrode(s)may be connected to the source potential.

FIG. 3A is a schematic cross-sectional view of the first trench 115illustrated in FIG. 1. In the embodiment illustrated in FIG. 3A, thefirst trench 115 is partly filled with a conductive material 1650.

According to an embodiment, the conductive material 1650 includes atleast one of carbon (C), molybdenum (Mo), titanium (Ti), tantalum (Ta),copper (Cu) and aluminum (Al).

According to an embodiment, a void 164 may be formed in the conductivematerial 1650 that at least partially fills up the first trench 115. Theconductive material 1650 may also be at least partially porous. As anexample, porous Cu and/or porous Mo may form part of or constitute theconductive material 165. A porous metal may be formed by the so-calledplasmadust technology, for example.

According to several embodiments, a thermal expansion coefficient of theconductive material 1650 and the semiconductor substrate 110 differ byless than 500% or by less than 300%. When selecting the conductivematerial 1650 in consideration of the thermal expansion coefficientrelative to the semiconductor substrate 110, a negative impact on devicereliability due to stress induced by a thermal budget can be avoided orreduced. In this regard, a porous structure of the conductive material1650 or a structure including a void may be beneficial with regard tolowering of stress induced by a thermal budget.

FIG. 3B is a schematic cross-sectional view of the first trench 115illustrated in FIG. 1 partly filled with a conductive material 1651 anda diffusion barrier 167 on top of the conductive material 1651.Above-described details of the conductive material 1650 illustrated inFIG. 3A apply to the conductive material 1651. The diffusion barrier 167may include at least one of TiN, TaN, Si₃N₄, SiO₂, and any combinationthereof. Arrangement of the diffusion barrier 167 is beneficial in casediffusion of the conductive material 1651 out of a top side of the firsttrench 115 should be avoided or minimized.

FIG. 3C is a schematic cross-sectional view of the first trench 115illustrated in FIG. 1 partly filled with a conductive material 1651 anda diffusion barrier 168 lining a top side and lateral sides of theconductive material 1651. Details of the conductive material 1650illustrated in FIG. 3A also apply to the conductive material 1651. Thediffusion barrier 168 may include at least one of TiN, TaN, Si₃N₄, SiO₂,and any combination thereof. As an example, a part of the diffusionbarrier 168 lining sides of the conductive material 1651 and a part ofthe of the diffusion barrier 168 lining the top side of the conductivematerial 1651 may be of different material. As an example, the part ofthe diffusion barrier 168 lining lateral sides of the conductivematerial 1651 may include TiN and the part of the of the diffusionbarrier 168 lining the top side of the conductive material 1651 mayinclude Si₃N₄. Arrangement of the diffusion barrier 168 is beneficial incase diffusion of the conductive material 1651 out of a top side orlateral sides of the first trench 115 should be avoided or minimized.FIG. 3C is a schematic cross-sectional view after thinning of thesemiconductor substrate 110 and after applying the contact layer 135.According to an embodiment, diffusion barrier 168 initially may also bepresent below the conductive material 1651 and may be removed during thethinning process. However, diffusion barrier 168 may also remain presentbetween contact layer 135 and conductive material 1651.

FIG. 3D is a schematic cross-sectional view of the first trench 115illustrated in FIG. 1 partly filled with a conductive material 1652 anda dielectric 169 at a bottom side of the first trench 115. Details ofthe conductive material 1650 illustrated in FIG. 3A apply to theconductive material 1652. As an example, a material of the dielectric169 at the bottom side may be chosen in view of its etch selectivitywith respect to the material of the semiconductor substrate 110. As anexample, the dielectric 169 may include or consist of SiO₂ and thesemiconductor substrate may include or consist of Si. In this case, achange in a characteristic during removal of the semiconductor substrateoccurs when reaching the dielectric 169. This change in acharacteristic, e.g., grinding resistance, can be used to terminateremoval of the semiconductor substrate. To take full advantage of theconductive material 1652, an optional contact doping 133 of thesemiconductor substrate 110 may be implemented, which ensures a lowohmic resistance between the conductive material 1652 and the contactlayer 133. Alternatively or additionally, the dielectric 169 may beremoved before applying the contact layer 133.

The fillings illustrated in FIGS. 3A and 3D are examples. Other fillingswith conductive material or combinations of filling elements illustratedin different examples may apply. As an example, a diffusion barrier mayalso be arrange at a bottom side of the first trench 115.

FIG. 4 is a schematic illustration of one embodiment of a profile ofn-doping and p-doping along line A-A′ of FIG. 1.

The semiconductor substrate 110 includes a background p-doping. As anexample, the semiconductor substrate 110 may be formed from a p-dopedsemiconductor wafer, e.g. a p-doped 12 inch silicon wafer such as a 8Ωcm/12 inch silicon wafer doped with boron. The p-background doping isconstant and denoted by P in FIG. 4. The semiconductor substrate 110further includes n-type dopants. A profile of concentration of then-type dopants decreases along the lateral direction x from a sidewallof the first trench 115 into the semiconductor substrate 110. As anexample, the n-type dopants may be diffused out of a diffusion source atsidewalls of the first trench 115 into the surrounding semiconductorsubstrate 110. As a result, the previously p-doped semiconductor waferbecomes n-doped. In an alternative embodiment, the n-doped layer isgrown, e.g., epitaxially grown, on a p-doped semiconductor substrate110. In this case, any form of the n-dopant concentration can be chosenand the p-background doping only may be present, for example, fromoutdiffusion of the semiconductor substrate 110.

Apart from conductive fillings in the first trench 115 as illustrated inthe examples of FIGS. 3A to 3D, doping of the semiconductor substrate110 via a diffusion source in the first trench 115 further allowsimprovement of the conductivity of the semiconductor substrate 110, andhence a reduction of parasitic resistance of vertical semiconductordevices formed in the semiconductor substrate 110. In other words, thesemeasures allow the reduction of the on-state resistance in a verticalsemiconductor device.

FIG. 5 is a schematic plane view illustrating several trench geometriesthat may be used individually or in any combination as geometries of thefirst trench 115 illustrated in FIG. 1. As an example, the first trench115 may form a closed loop 1151 surrounding an active area of a discretesemiconductor or an integrated circuit. The closed loop may alsocircumvent a junction termination area of the discrete semiconductor ora device area of the integrated circuit. As a further example, the firsttrench 115 may be arranged as a pattern of columns 1152 having acircular or elliptical cross-sectional area. As yet another example, thefirst trench 115 may be arranged as stripes 1153 or a sequence ofstripe-shaped segments 1154. A combination of any of these or furthergeometries may be applied. As an example, the trench forming the closedloop 1151 may have a larger width than the stripes 1153 or segments1154. In this case, the trench forming the closed loop 1154 may extenddeeper into the semiconductor substrate than the stripes 1153 andsegments 1154. Separating devices surrounded by the closed loop 1154 maybe carried out by removing semiconductor material from a rear side up toa bottom side of the closed loop 1154 and from a front side up to a topside of the closed loop. When diffusing P out of a trench formed as theclosed loop 1154, i.e., out of a trench surrounding an active devicearea, an efficient getter layer may be provided, acting againstdiffusion of heavy metals from a chip edge into the active device area.

As an example, a lateral distance between neighboring first trenches 115and the conductive filling may be appropriately chosen to adjust aconductivity of the semiconductor substrate to the needs required forthe device(s) to be formed therein.

FIGS. 6A and 6B illustrate a schematic cross-sectional view and aschematic plane view of a semiconductor wafer 600 according to anembodiment. The semiconductor wafer may have a diameter of 4 inches (100mm), 6 inches (150 mm), 8 inches (200 mm), 12 inches (300 mm), or more.The semiconductor wafer 600 illustrated in the schematic plane view ofFIG. 6A is a semiconductor wafer 600 including a silicon substrate 610.As is illustrated in the schematic cross-sectional view of FIG. 6B, afirst trench 615 extends into the silicon substrate 610 from a firstside 620. A silicon layer 625, realized by an epitaxial process orrealized by a reflow process of silicon close to a surface by anappropriate annealing process in combination with a subsequent epitaxialdeposition of a silicon layer or realized by a wafer bonding process,adjoins the silicon substrate 610 and caps the first trench 615 at thefirst side 620. A top side and a bottom side of the first trench 615 mayinclude a curved shape that may be due to surface diffusion mediatedreflow of material of the semiconductor substrate 610 by a heattreatment of the semiconductor substrate 610 when forming the siliconlayer 625 capping a top side of the first trench 615. Examples ofgeometries of the first trench 615 in plan view are illustrated in FIG.5. Examples of fillings of the first trench 615 and doping profiles ofthe semiconductor substrate are illustrated in FIGS. 3A to 3D and 4.

FIG. 6C illustrates a scanning electron micrograph of a part of asilicon substrate as illustrated in FIGS. 6A and 6B.

FIG. 7 is a simplified flowchart of a method of manufacturing asemiconductor device according to an embodiment.

Process feature S700 includes forming a first trench into asemiconductor substrate from a first side.

Process feature S710 includes forming a semiconductor layer adjoiningthe semiconductor substrate at the first side, wherein the semiconductorlayer caps the first trench at the first side.

Process feature S720 includes forming a contact at a second side of thesemiconductor substrate opposite to the first side.

According to an embodiment, forming the semiconductor layer on thesemiconductor substrate includes surface diffusion mediated reflow ofmaterial of the semiconductor substrate at the first side by a heattreatment of the semiconductor substrate in a temperature range between900° C. and 1400° C., and in an ambient environment including hydrogen,and depositing a first semiconductor layer by epitaxy. Afterwards, anepitaxial silicon layer can be deposited on this semiconductor layer.

According to yet another embodiment, the method further includes forminga dielectric at a bottom of the first trench. The dielectric may cause aprocess of removing the semiconductor substrate from the second side tostop when the process of removing the semiconductor substrate reachesthe dielectric at the bottom of the first trench.

According yet another embodiment, the method further includes fillingthe first trench at least partly with a conductive material beforeforming the semiconductor layer. With regard to the conductive materialand optional diffusion barrier(s), reference is drawn to the embodimentsillustrated in FIGS. 3A to 3D and the related part of the descriptionabove.

According to yet another embodiment, the method further includes forminga diffusion source in the first trench and introducing dopants from thediffusion source into the semiconductor substrate by a thermaltreatment. A diffusion profile as illustrated in FIG. 4 may result.

FIG. 8A is a schematic cross-sectional view of a semiconductor substrate810 after forming first trenches 815 from a first side 820. As anexample, the semiconductor substrate may be a 12-inch (300 mm)semiconductor wafer, or may include a wafer diameter smaller than 12inches, e.g. 8 inches (200 mm) or 6 inches (150 mm), or may include awafer diameter of more than 300 mm. The first trenches 815 may be formedinto the semiconductor substrate 810 by an appropriate etch process, forexample anisotropic etching such as dry etching.

According to an embodiment, the first trenches 815 may be etched to adepth d ranging between 20 μm and 200 μm. An aspect ratio of thetrenches may range between 10 and 50. The portions to be etched in thesemiconductor substrate 810 may be defined by an etch mask, e.g., apatterned hard mask or a patterned photoresist on the semiconductorsubstrate 810.

An optional diffusion source, e.g., a doped glass or a highly dopedsemiconductor layer, may be arranged at sidewalls of the trenches 815after a cleaning process. Thermal heating may be carried out to diffusedopants from the dopant source into the semiconductor substrate 810surrounding the first trenches 815. When increasing a thermal budget,e.g., by increasing a duration of thermal heating and/or by increasing amaximum temperature during thermal heating, a number of dopants and anextension of these dopants into the semiconductor substrate 810 can beincreased. The dopants introduced into the semiconductor substrate 810may lead to a change of the original conductivity type. As an example,when starting with a p-doped silicon wafer and introducing n-typedopants such as P into the silicon wafer via sidewalls of the firsttrenches 815 by diffusion out of a diffusion source, the conductivitytype of the silicon wafer may be set from p-type to n-type (or viceversa). When increasing the thermal budget and decreasing a spacingbetween neighboring first trenches 815, a variation of dopingconcentration along a lateral direction can be reduced due to overlap ofdiffusion profiles resulting from opposite first trenches 815. Thediffusion source may be removed from the trench after the diffusionprocess, e.g., by an etch process.

Referring to the schematic cross-sectional view of the semiconductorsubstrate 810 illustrated in FIG. 8B, the trenches 815 are partly filledwith a conductive material 865. As an example, the conductive material865 includes or consists of carbon (C). This allows to provide aself-aligned stop at a bottom side of the carbon when removing thesemiconductor substrate 810 from a second side 830 opposite to the firstside 820.

The first trenches 815 may be partly or fully filled with the conductivematerial 865 and the conductive material 865 may include voids. Apartfrom carbon constituting the conductive material 865, other conductivematerials may be used. Conductive materials having a thermal expansioncoefficient similar to a material of the semiconductor substrate 810 maybe beneficial with regard to counteracting stress induced by a thermalbudget acting on the semiconductor substrate 810 during furtherprocessing. According to other embodiments, metals and/or metal alloysor layer stacks of different metals and/or metal alloys may be used toadjust a desired thermal expansion coefficient of the conductivematerial 865 in the first trenches 815.

If a diffusion constant of the conductive material 865 filled into thefirst trenches 815 is too high with regard to a material of thesemiconductor substrate 810, a surface of the first trenches 815 and/ora top side of the conductive material 865 may be covered with adiffusion barrier, e.g., one or a plurality of TiN, TaN, Si₃N₄, SiO₂.Also, a combination of these materials may be used. The diffusionbarrier may encapsulate the conductive material 865 formed in the firsttrenches 815. In other words, the diffusion barrier may line sidewallsand a bottom side of the trench as well as a top side of the conductivematerial 865 filled in the first trenches 815. Thus, contamination ofprocess equipment or other wafers by out-diffusion can be avoided orreduced. This further allows for a larger number of conductive materialsthat may be used.

Referring to the schematic cross-sectional view of the semiconductorsubstrate 810 illustrated in FIG. 8C, a semiconductor layer 825 isformed on the semiconductor substrate 810 and adjoins the semiconductorsubstrate 810 at the first side 820. The semiconductor layer 825 capsthe first trenches 815 at the first side 820. In case the trench is notcompletely filled with conductive material, formation of thesemiconductor layer 825 includes, for example surface diffusion mediatedreflow of material of the semiconductor substrate 810 by a heattreatment of the semiconductor substrate 810. In case of a siliconsubstrate, a temperature may range between 900° C. and 1400° C. in anambient including hydrogen. Alternatively, a remaining trench volume ofan incomplete filling with conductive material may be filled withsilicon by lateral epitaxy or lateral epitaxial overgrowth.

By surface diffusion mediated reflow of material, edges of a top side ofthe first trenches 815 can be rounded and the top sides of the firsttrenches 815 can be closed. Subsequently, a semiconductor layer 825 maybe deposited by epitaxy on the semiconductor substrate 810 at the firstside 820. If the trench is completely filled with conductive material,epitaxial lateral overgrowth of the silicon layer will result in ahomogeneous silicon layer 825. A material of the semiconductor layer 825deposited on the semiconductor substrate 810 may correspond to thematerial of the semiconductor substrate 810. According to anotherembodiment, these materials may differ, leading to a stress induced inthe semiconductor layer 825 deposited on the semiconductor substrate810. By appropriate choice of materials, the stress induced in thesemiconductor layer 825 deposited on the semiconductor substrate 810 maybe kept in a range that is acceptable for further processing of asemiconductor device.

According to an embodiment, a part of the semiconductor substrate 810 atthe first side 820 may be removed, after closing the first trenches 815by surface diffusion mediated reflow of the material of thesemiconductor substrate 810, and before depositing a semiconductor layerthereon. As an example, chemical mechanical polishing (CMP) may be used.

The semiconductor layer 825 deposited on the semiconductor substrate 810may be formed by epitaxy, using process gases such as trichlorosilane(TCS) or dichlorosilane (DCS) when forming the semiconductor layer 825as a silicon layer.

When closing the first trenches 815 by surface diffusion mediated reflowof material of the semiconductor substrate 810, a width of the firsttrench may range between 0.2 μm to 5 μm, for example.

Since mesa regions between opposing first trenches 815 lack a formedclosure, a top side of a wafer may deflect with regard to thesemiconductor substrate 810, leading to a beneficial reduction of waferbow.

Known processes for forming a discrete semiconductor or circuit elementsof an integrated circuit in the semiconductor layer 825, e.g., ionimplantation processes for forming p- and n-doped semiconductor zones inthe semiconductor layer 825 may follow. Examples of device(s) that maybe formed in the semiconductor layer 825 are illustrated in FIGS. 2A and2B.

Referring to the schematic cross-sectional view of the semiconductorsubstrate 810 illustrated in FIG. 8D, a part of the semiconductorsubstrate 810 is removed from the second side 830. According to anembodiment, the semiconductor substrate 810 is removed from the secondside up to a bottom side of the first trench 815. According to anotherembodiment, removal of the semiconductor substrate 810 ends beforereaching a bottom side of the first trenches 815. In other words, a partof the semiconductor substrate 810 may remain below a bottom side of thefirst trenches 815.

When removing the semiconductor substrate 810 from the second side 830up to a bottom side of the first trenches 815, reaching a material at abottom side of the first trench 815, e.g., C or SiO₂, may lead to achange in a characteristic during removal of the semiconductor substrate810 that may be used to terminate to process of removing thesemiconductor substrate 810.

Referring to the schematic cross-sectional view of the semiconductorsubstrate 810 illustrated in FIG. 8E, a contact 835 including a layer ora layer stack of a conductive material such as a metal or metal alloy isformed at the second side 830. Prior to deposition of a backsidemetallization, an ion implantation through the second side 830 can becarried out, e.g., using a high-dose phosphorous or boron implantationto form a low-ohmic n- or p-backside contact.

Further known processes may follow to manufacture a desiredsemiconductor device. As regards the conductive material 865 andoptional diffusion barrier(s) filled in the first trenches 815,reference is drawn to the embodiments illustrated in FIGS. 3A to 3D.

According to another embodiment, the first trenches 815 may be filledwith conductive material(s) after closing the first trenches 815 at thefirst side 820. In other words, the first trenches 815 may be filledwith conductive material(s) after removing the semiconductor substrate810 from the second side 830 to a bottom side of the first trenches 815.

The above-described device(s) and method(s) allow for a reduced on-stateresistance of vertical semiconductor devices by improving a conductivityof a semiconductor substrate with one or a combination of the measuresdescribed above.

The above measures improve heat dissipation and heat capacity ofsemiconductor devices. This may allow other measures such as front sidecooling and/or flip-chip mounting to be dispensed with.

Alignment of the first trenches 815 may be adapted to an alignment ofdevice elements in the semiconductor layer 825. As an example,stripe-shaped first trenches 815 may be aligned in parallel tostripe-shaped transistor cells in the semiconductor layer 825. Thereby,wafer bow or substrate bow may be reduced.

As a further example, first trenches 815 including voids may be arrangedin an edge area of a semiconductor device, e.g., in an edge area of atransistor cell array. The trenches 815 may be partly or fully filledwith a dielectric, e.g., SiO₂. This allows the reduction or avoidance ofcharge carrier injection in the edge area when operating a body diode(similar to the principle of high dynamic ruggedness (HDR) of IGBT anddiode).

Although specific embodiments have been illustrated and describedherein, it will be appreciated by those of ordinary skill in the artthat a variety of alternate and/or equivalent implementations may besubstituted for the specific embodiments shown and described withoutdeparting from the scope of the present invention. This application isintended to cover any adaptations or variations of the specificembodiments discussed herein. Therefore, it is intended that thisinvention be limited only by the claims and the equivalents thereof.

What is claimed is:
 1. A semiconductor device, comprising: asemiconductor substrate; a first trench extending into or through thesemiconductor substrate from a first side, the first trench being atleast partially filled with a conductive material and electricallyconnected to the semiconductor substrate via a doped semiconductor layerat a sidewall of the first trench; a semiconductor layer adjoining thesemiconductor substrate at the first side, the semiconductor layercapping the first trench at the first side; and a contact at a secondside of the semiconductor substrate opposite to the first side.
 2. Thesemiconductor device of claim 1, further comprising: a second trenchextending into the semiconductor layer, wherein a bottom side of thesecond trench ends within the semiconductor layer and above thesemiconductor substrate.
 3. The semiconductor device of claim 1, whereinthe semiconductor substrate includes p-type dopants and n-type dopants,and wherein a concentration of the p-type dopants is lower than aconcentration of the n-type dopants.
 4. The semiconductor device ofclaim 3, wherein the semiconductor substrate is a silicon substratehaving a concentration of boron between 5×10¹⁴ cm⁻³ and 5×10¹⁵ cm⁻³. 5.The semiconductor device of claim 3, wherein the semiconductor substrateincludes n-type dopants, and wherein a profile of concentration of then-type dopants decreases from a sidewall of the first trench into thesemiconductor substrate along a lateral direction parallel to the firstside.
 6. The semiconductor device of claim 1, wherein a thermalexpansion coefficient of the conductive material and the semiconductorsubstrate differ by less than 500%.
 7. The semiconductor device of claim1, wherein the conductive material comprises at least one of C, Mo, Cu,Al, Ti, Ta, and W.
 8. The semiconductor device of claim 1, furthercomprising a void in the first trench.
 9. The semiconductor device ofclaim 1, wherein the conductive material is at least partially porous.10. The semiconductor device of claim 1, further comprising a diffusionbarrier between the conductive material and the semiconductor substrate.11. The semiconductor device of claim 1, wherein the diffusion barriercomprises at least one of TiN, TaN, and TiW.
 12. A semiconductor device,comprising: a semiconductor substrate; a first trench extending into orthrough the semiconductor substrate from a first side, the first trenchbeing partially filled with a conductive material having a verticaldistance to a top side of the first trench; a semiconductor layeradjoining the semiconductor substrate at the first side, thesemiconductor layer capping the first trench at the first side; and acontact at a second side of the semiconductor substrate opposite to thefirst side.
 13. The semiconductor device of claim 12, wherein theconductive material is electrically connected to the semiconductorsubstrate via a doped semiconductor layer at a sidewall of the firsttrench.
 14. The semiconductor device of claim 13, wherein a dopantconcentration of the doped semiconductor layer decreases from a sidewallof the first trench into the semiconductor substrate along a lateraldirection parallel to the first side.
 15. A method of manufacturing asemiconductor device, the method comprising: forming a first trench in asemiconductor substrate from a first side; forming a semiconductor layeradjoining the semiconductor substrate at the first side, thesemiconductor layer capping the first trench at the first side; andforming a contact at a second side of the semiconductor substrateopposite to the first side.
 16. The method of claim 15, wherein forminga semiconductor layer adjoining the semiconductor substrate at the firstside comprises: surface diffusion mediated reflow of material of thesemiconductor substrate at the first side by a heat treatment of thesemiconductor substrate in a temperature range between 900° C. and 1400°C. and in an ambient environment including hydrogen; and depositing afirst semiconductor layer by epitaxy.
 17. The method of claim 15,further comprising forming a dielectric at a bottom of the first trench.18. The method of claim 15, further comprising filling the first trenchat least partly with a conductive material before forming thesemiconductor layer.
 19. The method of claim 15, further comprising:forming a diffusion source in the first trench; and introducing dopantsfrom the diffusion source into the semiconductor substrate by a thermaltreatment.
 20. The method of claim 15, further comprising removing thesemiconductor substrate from the second side up to a bottom of the firsttrench.